Semiconductor Packaging Inspection
- Semiconductor Packaging Inspection
- For TO, SOT, SOD, SOP and other series of discrete devices
- Character Inspection
- Pin Measurement
- Coplanarity Measurement
- Gating Positioning
More Solutions
- Polishing Positioning
- Communication with Robot MODBUS, Application in Harsh Environments
- Makeup Pencil Assembly
- Navigation Picks Different Products
- Flexible Production Line, Rapid Variety Switching
- Double Belts Improve Navigation Efficiency
- Rotary Cylinder Added to Z-Axis Front End to Enhance Flexibility
- Chip Sorting Test
- QR Code Recognition, Character Recognition
- Direction Determination, Presence or Absence Judgment
- Positioning and Grasping
- Testing Fixture Precise Placement
3C Industry Assembly and Testing
- 3C Industry Assembly and Inspection
- Belt Picking
- Spot Welding Positioning
- Chip Stacking
- Special-shaped Plug-in
- Auxiliary Material Mounting
Backlight assembly, adhesive strip attachment
- Backlight assembly, adhesive strip attachment
- Supports up to 20 million pixel camera
- Supports up to eight camera stations
- Can communicate independently with up to eight liLC units
- Lamination accuracy ±0.05 mm (equipment precision capability must be considered)
Electronic Components Inspection
- Electronic Component Inspection
- • Measurement of pin length, spacing, bending, etc.
- • Measurement of length, width, and height
- • Measurement of pin coplanarity
- • Solder inspection
- • Presence or absence inspection
- • Character inspection
Contact Us
National Unified Service Hotline
Contact Person: Liu Junting
Email: jsmv01@163.com
Website: www.exaivision.com
Address: Building 2, No. 7 Xinghua Road, Shijing, Dongcheng Street, Dongguan City, Guangdong Province
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